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Description Schematic process flow of dry etch and photosensitive BCB wafer bonding technique.
Date (UTC)
Source J. Oberhammer and F. Niklaus and G. Stemme, Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities (2003)
Author Fraunhofer ENAS, D. Neumann
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Attribution: Fraunhofer ENAS
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current11:54, 10 April 2011Thumbnail for version as of 11:54, 10 April 2011635 × 850 (27 KB)Enaswiki{{Information |Description ={{en|1=Schematic process flow of dry etch and photosensitive BCB wafer bonding technique}} |Source ={{own}} |Author =Enaswiki |Date = |Permission ={{cc-by-sa-3.0-de|Fraunhofer

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