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Summary

Description
English: Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm
Date (UTC)
Source M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)
Author Fraunhofer ENAS, D. Neumann

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  • 2011-03-30 11:17 Enaswiki 3476×2805× (1516697 bytes) {{Information |Description = Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm |Source = M. Wiemer and C. Jia and M. Töpper and K. Hauck, Wafer Bonding with BCB and SU-8 for MEMS Packaging (2006)

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30 March 2011

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Date/TimeThumbnailDimensionsUserComment
current09:11, 3 September 2011Thumbnail for version as of 09:11, 3 September 20113,476 × 2,805 (1.45 MB)File Upload Bot (Magnus Manske) {{BotMoveToCommons|en.wikipedia|year={{subst:CURRENTYEAR}}|month={{subst:CURRENTMONTHNAME}}|day={{subst:CURRENTDAY}}}} {{Information |Description={{en|Cross-sectional view of bonded wafer pair with an intermediate BCB layer width of 100 µm}} |Sourc

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